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Site Engineer @ High Technext

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 Site Engineer

Job Description

Dear Candidate,


GREETINGS OF THE DAY FROM HIGH TECHNEXT ENGINEERING AND TELECOM PVT LTD.


Congratulations!!We are glad to inform you that we have selected your Curriculum Vitae for an interview in our organization.

Designation:"SITE ENGINEER"

Job Type:Full time

Eligibility:Fresher (Preferred) / Experienced

Location:West Bengal, Orissa, Entire North East, Bihar, Jharkhand, Delhi (NCR), Punjab, Uttar Pradesh, Madhya Pradesh, Pune, Maharashtra, Haryana, Hyderabad (Pan India).

Salary Package in CTC(Cost To Company):INR 18,000/- to 25,000/-[Basic Salary+Accommodation( Lodging) & Travelling Allowance]3months Probation Period isincluded.

N.B:-THE FINAL SALARY & CTC PACKAGE WILL BE BASED UPON YOUR INTERVIEW.

N.B:-YourSalary will be hiked up to50% based upon your performance after 3 months probation period.

Facility Provided after 3 Months of Probation Period:Insurance worth Rs. 1 Lac+ ESI+ Provident Fund


Job Description:LOS survey, EMF survey, UBR survey, RF survey and optimization, BTS Installation, Commissioning, Microwave Link, Small cell, IBS Work, 3G/ 4G implementation, LCRM (Linear Count Rate Meter).

Interview date :25th November(Thursday).


Timing-11.30 am to 2.30 pm.

Interview Address:

Block EN- 13, Antariksha Tech Park, 7th Floor, Maclean House

Salt lake sec-V, Kolkata-700091

Bus Stop: Webel More

Landmark: Opposite of Amrit Tower

West Bengal, India.

Required documents for Interview:

1.Updated C.V 1 copy.

2. Interview Call Letter (Printout of this call letter).


Important Instructions To Be Followed:

1.Wearing Mask is mandatory in the office.

2.Maintain at least 1-meter distance between yourself and others.

3.Candidates must not have a fever, any respiratory problem, cold & flu- type symptoms.

N.B:-It is being informed about the Bonding procedure of our company. Every employee has to sign a bond with our company for 1 year on the date of joining if they successfully qualify the interview process. They cannot leave the job before 1 year. For the bonding procedure the employee has to deposit an amount ofRs. 20,000/-as security money which will be refunded after 1 year of successfull service in the company.This amount is taken due to training & security purposes and Telecom Equipment like Telecom Laptop,GPS, Tablet, Mirror Compass,Safety Helmets and Harness Belts, Narda Toolkit Etc. which will be provided by the company as per project requirement. The whole matter of the Bonding Process will be written on the 100 rupee or 50 rupee stamp paper that the employee has submitted the amount to the company for training and Telecom equipment purposes & The company will return the amount to them after successfully completion of 1 year of service in the company.You will be provided a Xerox copy of the Bond Paper.


Corporate Office:

Block:EN-13, Antariksha Tech. 7th Floor, Near WEBEL more

Saltlake Sec-V, Kolkata-700091

West Bengal, India

Website:www.high-technext.com

Best Regards,
--


K CHAKRABORTY


HR Executive,High Tech Next Engineering and Telecom Pvt Ltd
7908814***
www.high-technext.com
ex******e@hi**********t.com
Block EN-13 Antariksha Tech Park Opposite Amrit Tower, Webel More




























Employement Category:

Employement Type: Full time
Industry: Telecom / ISP
Role Category: Site Engineering / Project Management
Functional Area: Not Applicable
Role/Responsibilies: Site Engineer

Contact Details:

Company: High Technext
Location(s): Multi-City, India

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High Technext

something  About  High-Technext Formed in 2012  by a highly innovative team, High-Technext Engineering  & Telecom Pvt Ltd. is a leading telecom products manufacturer, providing world-class, hardware products and solutions for the telecom industry.High-Technext is to be a g...